| Display Size | 2.8-inch diagonal TFT LCD module; commonly designed for compact handheld and embedded equipment. | Custom active-area layout, viewing-window dimensions, cover-lens integration, and mechanical outline. | Confirm the required enclosure space, bezel width, active area, and mounting-hole position before tooling. |
| Resolution | 240 × 320 pixels is a common portrait-oriented resolution for this size class. | Alternative resolutions may be available depending on the controller, interface, pixel density, and project volume. | Higher resolution can improve image detail but may increase controller, memory, bandwidth, and cost requirements. |
| Panel Technology | Thin-film transistor LCD using a-Si technology; TN and IPS configurations are commonly used in small displays. | TN or IPS selection, color performance, viewing-angle target, and display-mode optimization. | IPS is generally preferred when wider viewing angles and more consistent color are required. |
| Aspect Orientation | Portrait operation is typical for 240 × 320 displays, while landscape operation is supported by software rotation. | Portrait, landscape, or 180-degree image rotation; custom graphical user-interface orientation. | Define the preferred orientation early to coordinate the FPC, connector position, and enclosure design. |
| Interface Options | Common interfaces include 4-wire SPI, 3-wire SPI, parallel RGB, and 8080-style MCU interfaces, depending on the module design. | Interface type, pin assignment, connector pitch, FPC length, contact orientation, and signal mapping. | SPI reduces pin count; parallel interfaces can provide higher data throughput for faster screen updates. |
| Touchscreen Integration | Resistive or projected capacitive touch panels can be integrated with a 2.8-inch display module. | Touch technology, cover glass thickness, surface treatment, sensor pattern, controller, and bonding method. | Projected capacitive touch is suited to multi-touch user interfaces; resistive touch can support stylus or gloved operation. |
| Brightness | Typical small TFT modules are available in approximate brightness ranges of 250–500 cd/m², depending on the backlight design. | LED quantity, LED current, backlight brightness, brightness uniformity, and dimming method. | Higher brightness improves readability in bright environments but can increase power consumption and heat. |
| Backlight Control | White LED backlights are standard; control may be provided through a power rail, resistor setting, or PWM input. | PWM dimming, enable control, LED current specification, connector pinout, and brightness calibration. | Check the host system's available voltage, current capacity, PWM frequency, and logic-level compatibility. |
| Viewing Angle | TN panels commonly provide narrower viewing angles; IPS panels typically provide wider horizontal and vertical viewing angles. | Panel mode, optical compensation, viewing-angle optimization, and image-quality tuning. | Use the final installation angle and lighting environment to determine the required viewing-angle performance. |
| Color Performance | Color depth is commonly driven by the selected controller and interface, with 262K or 16.7M color operation available on compatible designs. | RGB color format, gamma adjustment, white-point tuning, color calibration, and image-quality inspection criteria. | Confirm whether the host processor supports the selected color format and pixel data arrangement. |
| Operating Temperature | Commercial-grade modules commonly support approximately 0°C to 70°C; wider ranges may be available for specialized applications. | Extended-temperature components, operating-temperature validation, storage-temperature requirements, and thermal testing. | Specify actual ambient temperature, internal enclosure temperature, humidity, and condensation risks. |
| Mechanical Customization | Module thickness, outline dimensions, FPC placement, and mounting features vary by construction. | Custom FPC shape, cable length, connector location, mounting holes, adhesive area, bezel, and metal-frame design. | A finalized mechanical drawing and 3D enclosure reference reduce integration and tooling revisions. |
| Optical Bonding | Air-gap assembly is common; optical or full bonding can improve readability and reduce internal reflections. | OCA or OCR bonding, cover glass, anti-glare coating, anti-reflective treatment, and anti-fingerprint coating. | Bonding selection should consider impact resistance, outdoor readability, repairability, and project cost. |
| Controller and Software Support | Controller selection depends on resolution, interface, frame-buffer requirements, touch function, and host processor compatibility. | Controller configuration, initialization code, display timing, touch firmware, test commands, and reference drivers. | Request complete initialization parameters and confirm compatibility with the target MCU, SBC, or embedded platform. |
| Quality and Validation | Professional production validation typically covers appearance, electrical performance, touch response, display uniformity, and reliability. | Customized inspection standards, sampling plan, aging test, temperature cycling, vibration testing, and inspection reports. | Define acceptable limits for dead pixels, bright spots, dark spots, mura, touch accuracy, and cosmetic defects. |
| Production and Supply Capability | Suitable manufacturing programs normally include engineering samples, pilot production, mass production, and ongoing quality control. | Prototype quantity, packaging, labeling, production testing, traceability, delivery schedule, and forecast-based supply planning. | Evaluate sample consistency, engineering response time, change-control procedures, and long-term component availability. |